Advanced BGA/CSP and Assembling Technology. Ceramic Substrate for CSP/MCM.

Advanced Multilayer Polyimide Substrate Utilizing UV Laser Microvia Technology

This paper presents ongoing work on an advanced flexible circuit interconnect substrate featuring a 24 x 24 (576 element) pad grid array pattern at 300 micron pitch. This eight metal layer circuit is being developed as a highdensity, pixel-level interconnection substrate for a two-dimensional (2D) ultrasound imaging transducer MEMS device. The flexible circuit substrate is constructed using lam...

Fracture Behavior of Advanced Ceramic

Microstructural, mechanical, and thermal-shock behavior of hot-gas candle fiters obtained from different manufacturers have been evaluated. These filters include both monolithic ceramic and composite materials. Based on the results obtained so far, composite filters perform better than monolithic ceramic filters in a thermal-shock environment. During thermal-shock testing, the monolithic cerami...

Advanced Radiation-Resistant Ceramic Composites

Ceramic matrix composites (CMC’s), particularly silicon carbide (SiC) fiber-reinforced SiC-matrix (SiC/SiC) composites, have been studied for advanced nuclear energy applications for more than a decade. The perceived potentials for advanced SiC/SiC composites include the ability to operate at temperature regimes much higher than heat-resistant alloys, the inherent low inducedactivation nuclear ...

Replamineform Inspired Bone Structures (ribs) Using Multi-piece Molds and Advanced Ceramic Gelcasting Technology

Replamineform Inspired Bone Structures (RIBS) using multi-piece molds and advanced ceramic gelcasting technology.Abstract A new technology was developed for quickly, simply, and affordably creating Replamineform Inspired Bone Structures (RIBS) that combines multi-piece mold manufacturing for creating complex macroscale geometries with advanced ceramic gelcasting technology for controlling micro...

Advanced Sintering of Nano-Ceramic Materials